Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0750280
Kind Code:
A
Abstract:
PURPOSE: To enable accurately working the thickness of a chip containing an α-ray shielding film, and prevent generation of contact failure when the rear of the chips are collectively brought into contact with a heat sink.
CONSTITUTION: A wafer 1 is cut into a semiconductor chips 3, and a silicon resin films 4 which are used for α-ray shielding and surface protection are stuck on the surfaces of the chips. The rear of the chip is ground with a diamond wheel 6 and a chip whose total thickness is (z) is obtained. A TAB lead 7 connects the parts between the semiconductor chips 3 and a wiring board 8, and the rear of the chips are brought into contact with a heat sink 9.
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Inventors:
KONO HIROMICHI
Application Number:
JP21208493A
Publication Date:
February 21, 1995
Filing Date:
August 05, 1993
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/301; H01L21/304; (IPC1-7): H01L21/304; H01L21/301
Attorney, Agent or Firm:
Yusuke Omi
Next Patent: CLEANING METHOD FOR SILICON WAFER