PURPOSE: To improve adhesive properties among each circuit and an electromagnetic wave shielding layer and the adhesive properties of each circuit and the electromagnetic wave shielding layer, and to enhance the conductivity of each circuit while preventing bleeding at the time of printing in a printed circuit board, in which a jumper circuit and the electromagnetic wave shielding layer are connected to a circuit pattern through a through-hole circuit,
CONSTITUTION: Metallic copper powder, surfaces of which are coated with titanate, zirconate or a mixture thereof, a resol phenolic resin, a thixotropic conditioner, an amino compound and a chelate layer forming agent are blended as a conductive coating material forming a through-hole circuit 20. Metallic copper powder, surfaces of which are coated with titanate, zirconate or the mixture thereof, resol type phenol, a chelate forming agent, an adhesive property improver and a conductivity improver are compounded as a conductive coating material forming a jumper circuit 7 and an electromagnetic wave shielding layer 9.
MURAKAMI HISATOSHI
MORIMOTO SHOHEI
