PURPOSE: To provide a prober, in which a conductive protrusion used as a contact in a probe card is adequately put in contact with an electrode pad in a chip.

CONSTITUTION: A movable plate 4 facing to a wafer stage 2 and a link arm 43 are provided so that the movable plate 4 kept in parallel with the wafer (W) can be rotated around an axis in parallel with the wafer (W). A flexible multilayer interconnection board 31 having bumps (conductive protrusions) 32 put in a row is mounted on the rear face of the movable plate 4. Both ends of the wiring board 31 is fixed to a printed board on the upper side. In this constitution, the wiring board 31 is pushed downward by a buffer body 44 in a notch part 41 that passes through the movable plate 4. when the wafer (W) abuts on the bump 32 and moves upward, the bump 32 pushes the electrode pad and slides sideways through rotating force of the movable plate 4 as well as restoring force of the buffer body 44. Then, the bump 32 abrades a natural oxide film on a surface of the electrode pad.