PURPOSE: To prevent wrong discrimination of unacceptable chips from acceptable chips at the time of inspecting chips on a wafer and physical damage of chips at the time of splitting the chips by arranging in advance simulated semiconductor devices at parts where defects are expected.

CONSTITUTION: Desired semiconductor devices 2 are arranged on a semiconductor substrate 1 and simulated semiconductor devices 3 are arranged at parts around the devices 2 where defects are expected.