Title:
WIRING METHOD FOR WIRING BOARD ASSEMBLY
Document Type and Number:
Japanese Patent JP3013962
Kind Code:
B2
Abstract:
PURPOSE: To provide a wiring method capable of quickly and accurately performing wiring and press-contact of a wiring board assembly by which an internal circuit of an electric connection box is formed, relating to the wiring method for the wiring assembly in the electric connection box used in such as connecting wire harness to each other.
CONSTITUTION: A plurality of front/rear part wiring heads E, F, paired relating to a wiring board 22, are respectively independently movably arranged, to interpose a plurality of electric wires 21 by a plurality of the front/rear part wiring heads E, F, and a plurality of the electric wires 21 are parallelly laid between two wiring board assemblies B, C. Next by respectively independently moving a group of each wiring head E, F, positioning is performed relating to a plurality of press-contact terminals 17, and also performing wiring by press-contact.
Inventors:
Mamoru Araki
Application Number:
JP30515093A
Publication Date:
February 28, 2000
Filing Date:
December 06, 1993
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
B60R16/02; H01B13/00; H01B13/012; H01R43/01; H05K13/06; (IPC1-7): H01R43/01; B60R16/02; H01B13/012; H05K13/06
Domestic Patent References:
| JP696829A | ||||
| JP6295752A |
Attorney, Agent or Firm:
Hiroshi Ochi (5 others)
Previous Patent: 水道管の着脱工具
Next Patent: METHOD AND EQUIPMENT FOR DETECTING INTERFACE BETWEEN MIXED LIQUIDS OF NON-COMPATIBLE SOLUTION
Next Patent: METHOD AND EQUIPMENT FOR DETECTING INTERFACE BETWEEN MIXED LIQUIDS OF NON-COMPATIBLE SOLUTION