PURPOSE: To reduce the metallic material to be used in vain and produce metallic pattern films having excellent transferability by patterning a metallic layer formed by vapor deposition on a film and further, forming a metallic layer thereon by chemical plating.

CONSTITUTION: The first metallic layer 2 consisting of nickel, silver, etc., is formed by vapor deposition on the film 11 consisting of polyethylene terephthalate, etc. This metallic layer 2 is then patterned by photoetching. The second metallic layer 3 is formed by chemical plating on the patterned metallic film 2. Metals, such as nickel and palladium, which are of the same kind as the metals of the first metallic layer 2 or the different kinds therefrom are usable as the second metallic layer. Further, an equally desirable alternative is to form a resist film on the first metallic layer 2 and to pattern this film, then to form the second metallic layer 3 and to selectively remove the specific regions of the first metallic layer 2 with this second metallic layer as a mask.