Title:
PACKAGE FOR IC
Document Type and Number:
Japanese Patent JPH0532286
Kind Code:
A
Abstract:
PURPOSE: To provide an IC package capable of preventing the bending of IC leads without using IC carrier and an improper part contact at the time of measuring the characteristic.
CONSTITUTION: An IC package is composed of an IC package part 1, IC lead parts 2 projecting from the IC package part 1 parallel to the bottom surface thereof and IC lead protecting parts 3 formed integrally with the IC package part 1 and extending in contact with the IC lead parts 2 and parallel thereto.
Inventors:
IWABUCHI TAKESHI
Application Number:
JP17789591A
Publication Date:
February 09, 1993
Filing Date:
July 18, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B65D85/00; B65D85/38; B65D85/86; H01L21/673; H01L21/68; (IPC1-7): B65D85/00; B65D85/38; H01L21/68
Attorney, Agent or Firm:
Seiichi Samukawa
Next Patent: TRAY FOR ELECTRONIC COMPONENT