Title:
CHIP MOUNTING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP3087619
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a chip mounting apparatus and method enabling the position detection of a display panel and chip with high accuracy by a high magnification camera and bonding the chip to electrodes on a transparent plate at high speed.
SOLUTION: A table 14 is disposed in front of a display panel 1 on a movable table and light refracting element 15 is mounted on the table 14. A chip 5 is positioned on the table 14 and a first mark M1 on the panel 1 and second mark N2 on the chip 5 are observed by a lower camera 10 focused on the mark M1. The mark 2 located at a higher position than the mark M1 is observed without being out of focus, since the element 15 is located below this position. From the observation result, an outer lead 6a is positioned relative to an electrode and bonded to it.
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Inventors:
Anto Onizuka
Application Number:
JP19306195A
Publication Date:
September 11, 2000
Filing Date:
July 28, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; G09F9/00; H01L21/68; H01L23/50; (IPC1-7): H01L21/60; G09F9/00; H01L21/68; H01L23/50
Domestic Patent References:
| JP7183340A | ||||
| JP5315392A | ||||
| JP5243335A | ||||
| JP5198623A | ||||
| JP8330393A | ||||
| JP7231008A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)