Title:
【考案の名称】高密度コネクタ
Document Type and Number:
Japanese Patent JPH0635379
Kind Code:
Y2
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Inventors:
Masashi Shimada
Application Number:
JP1680188U
Publication Date:
September 14, 1994
Filing Date:
February 10, 1988
Export Citation:
Assignee:
Minnesota Mining and Manyufu Acting Your Company
International Classes:
H01R4/24; A47F9/02; H01R9/03; H01R13/58; (IPC1-7): H01R9/07; H01R4/24
Domestic Patent References:
| JP61248380A | ||||
| JP6026768U | ||||
| JP58176372U |
Attorney, Agent or Firm:
Akira Asamura (2 outside)
Next Patent: 発熱パツク化粧料