PURPOSE: To enhance yield while maintaining the performance of a printing head and realize a low-cost and stable production by bonding a conductive substrate on a part of a piezoelectric element using an insulating adhesive.

CONSTITUTION: The full surface of a piezoelectric element 1 serving as a vibration source is bonded to a conductive film 4 of a vibration plate 5 as a component of a flow path through an adhesive layer 20. The expansion/contraction of the piezoelectric element 1 in both directions is converted to the vertical vibration, whereby a pressure fluctuation is produced in a pressure chamber 7. The electric conduction of the piezoelectric element 1 to the conductive film 4 is ensured by the surface roughness of the piezoelectric element 1. A conductive substrate 3 is bonded on the opposite surface of the piezoelectric element 1 through an adhesive 2, but is only overlapped thereon partially. By limiting the bonding width of the conductive substrate 3 on the piezoelectric element 1, the both can be mechanically and electrically bonded with each other in a stable manner with the minimum number of component parts without affecting the behavior of the piezoelectric element 1.