Title:
METHOD AND DEVICE FOR SOLDERING THIN WIRING BOARD
Document Type and Number:
Japanese Patent JPH0621646
Kind Code:
A
Abstract:
PURPOSE: To solder a thin wiring board without burning it.
CONSTITUTION: Wiring patterns 6 and 33 of thin wiring board 5 and thick wiring board 31 are faced each other and then soldered each other through heater heating. At that time, An exposed part H of the pattern 33 of the board 31 is heated by a heater 11 to solder both.
Inventors:
KIKUCHI HIROMI
Application Number:
JP17728992A
Publication Date:
January 28, 1994
Filing Date:
July 06, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/34; H05K3/36; (IPC1-7): H05K3/36; H05K3/34
Domestic Patent References:
| JPS6027471B2 | 1985-06-28 | |||
| JPS62224997A | 1987-10-02 | |||
| JPS6349275B2 | 1988-10-04 | |||
| JPH01261892A | 1989-10-18 | |||
| JPS5487870A | 1979-07-12 |
Attorney, Agent or Firm:
Teiichi
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