Title:
WAFER FORK AND ITS MANUFACTURE METHOD
Document Type and Number:
Japanese Patent JPH0653303
Kind Code:
A
Abstract:
PURPOSE: To provide a wafer fork in which wafers are not almost contaminated due to impurities and a generation such as a warp, etc., is not almost caused, and which has a high strength and is made with high dimensional precision, and an effective manufacturing method.
CONSTITUTION: In a wafer fork 1a for holding a semiconductor wafer and successively carrying it in a semiconductor manufacturing step, it is composed of a ceramic material of at least one of nitrided silicon (Si3N4) and SIALON (Si-Al-O-N), and comes into contact with the periphery of a held wafer 8 to form a marginal step 2 for holding the wafer 8 at a predetermined position and recesses 3 formed so as to oppose to each other without coming into contact with the wafer 8.
Inventors:
SHIODA TAKESHI
Application Number:
JP20529392A
Publication Date:
February 25, 1994
Filing Date:
July 31, 1992
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B65G49/07; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B65G49/07
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)
Next Patent: LOW-PRESSURE PROCESSING DEVICE