Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP3017742
Kind Code:
B2
Inventors:
Masayoshi Sasaki
Application Number:
JP22927388A
Publication Date:
March 13, 2000
Filing Date:
September 13, 1988
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/768; H01L21/314; H01L21/316; H01L23/522; (IPC1-7): H01L21/768; H01L21/314
Domestic Patent References:
| JP4917680A | ||||
| JP60250635A | ||||
| JP6027123A | ||||
| JP62206852A | ||||
| JP1143330A | ||||
| JP239534A |
Attorney, Agent or Firm:
Masaru Tsuchiya