Title:
【考案の名称】ビーム溶接におけるダイヤモンドブレード用チップ保持クランプ装置
Document Type and Number:
Japanese Patent JPH073965
Kind Code:
U
Inventors:
Tadao Nemoto
Suzuki ichiichi
Suzuki ichiichi
Application Number:
JP3878793U
Publication Date:
January 20, 1995
Filing Date:
June 24, 1993
Export Citation:
Assignee:
Sankyo Diamond Industry Co., Ltd.
International Classes:
B23D65/00; B23K37/04; B24D5/06; B24D5/12; B24D18/00; (IPC1-7): B24D18/00; B23D65/00; B23K26/02; B23K37/04; B24D5/06; B24D5/12
Domestic Patent References:
| JP4130162B2 | 2008-08-06 |
Attorney, Agent or Firm:
Akiyama Atsushi