Title:
DEVICE AND METHOD FOR MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0745652
Kind Code:
A
Abstract:
PURPOSE: To suppress a lowering of the yield of a resin-sealed semiconductor device caused by the movement of die pads on a lead frame.
CONSTITUTION: For example, electromagnets 27a and 27b are respectively positioned on the parts facing a cavity section 22 of a male and female molds 21a and 21b which clamp a lead frame 12. Then a magnetic force is applied to the lead frame 12 by exciting the electromagnets 27a and 27b and the position of the lead frame 12 is secured by utilizing the magnetic force. When the cavity section 22 is filled with a resin 23 under in a state, the movement of a die pad 12a can be prevented by the viscosity and speed of the resin 23.
Inventors:
AZUMA MICHIYA
EGASHIRA MIYOSHI
NODA YASUMASA
EGASHIRA MIYOSHI
NODA YASUMASA
Application Number:
JP18797993A
Publication Date:
February 14, 1995
Filing Date:
July 29, 1993
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B29C45/02; B29C45/26; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26
Attorney, Agent or Firm:
Takehiko Suzue
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