PURPOSE: To facilitate process control and prevent the lead deformation and the shape defects of a semiconductor element by performing resin part marking, lead cutting, formation and appearance inspection of the semiconductor element of a lead frame whose resin sealing process is completed by using one device.

CONSTITUTION: A lead frame whose major part is resin sealed, lead other than a hanging lead are cut and whose characteristic inspection of semiconductor elements are completed is supplied to a carrying means by a lead frame supplying part 100. Then, the lead frame resin part is marked by a marking part 200 according to the inspection results from the characteristic inspection. The hanging leads of the lead frame are cut to be in the prescribed shape as a semiconductor element. Appearance inspection is carried out by an appearance inspecting part 400 and semiconductor elements are stored on the tray 510 of a semiconductor storing part 500 by performance based on the characteristic inspection results and the appearance inspection results. Thus, the process control is facilitated and lead deformation is prevented.