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Patent Searching and Data


Title:
RADIATION SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH063823
Kind Code:
A
Abstract:

PURPOSE: To obtain a new radiation-sensitive resin compsn. having higher sensitivity than a conventional one to various radiation such as deep UV rays and electron beams.

CONSTITUTION: The resist liquid is prepared by dissolving 0.5g of partial allylether of poly(hydroxystyrene) (with 50% ether rate) as the resin and 35mg of triphenylsulfonium trifluoromethane sulfonate as an acid producing agent to 3ml of methoxyethyl acetate, and then filtering the liquid through a membrane filter.


Inventors:
ITO TOSHIO
SAKATA YOSHIKAZU
Application Number:
JP15838792A
Publication Date:
January 14, 1994
Filing Date:
June 18, 1992
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
G03F7/004; G03F7/028; G03F7/029; G03F7/038; H01L21/027; (IPC1-7): G03F7/038; G03F7/004; G03F7/028; G03F7/029; H01L21/027
Attorney, Agent or Firm:
Takashi Ogaki