Title:
MOLDING METHOD FOR INJECTION MOLDED PANEL HEATING PRODUCT
Document Type and Number:
Japanese Patent JP3038946
Kind Code:
B2
Abstract:
PURPOSE: To restrain the dispersion of manufacturing processes by injecting and molding a panel heating element made of thermoplastic resin mixed with 5 to 30vol.% of a conductive filler such as metallic fiber and carbon fiber, and covering the injection molded body with a resin insulation layer after drying.
CONSTITUTION: A panel heating element 3 is injection molded, using a material comprising thermoplastic resin mixed with 5 to 30vol.% of carbon black, carbon fiber, metal fiber, metal flake or the like as a conductive filler. Thereafter, the heating element 3 is exposed to an atmosphere of humidity 50% or more for 10 hours or longer, thereby allowing it to absorb the moisture. The element 3 after absorbing the moisture is dried at a temperature equal to 60°C or lower in a furnace. After drying, thermoplastic resin is injection molded on the surface of the element 3, thereby forming resin insulation layers 1 and 6. According to this construction, products with different electrical resistance characteristics can be manufactured, using the material of the same composition and, therefore, many types of products become variable, when several types of materials are prepared.
Inventors:
Hikaru Okamoto
Akabe Michio
Tamio Ooi
Masami Ishii
Akabe Michio
Tamio Ooi
Masami Ishii
Application Number:
JP3020891A
Publication Date:
May 08, 2000
Filing Date:
February 25, 1991
Export Citation:
Assignee:
Aisin Seiki Co., Ltd.
International Classes:
A47K13/30; H05B3/14; H05B3/20; (IPC1-7): H05B3/20; A47K13/30; H05B3/14
Domestic Patent References:
| JP556745A | ||||
| JP60231764A | ||||
| JP62160681A |