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Title:
衝撃波キャビテーション効果に基づくナノ層潤滑ダイヤモンド砥石研削装置
Document Type and Number:
Japanese Patent JP7464327
Kind Code:
B2
Abstract:
A nano-layer (41) lubricated diamond grinding wheel (20) grinding device based on a shock wave cavitation effect. The grinding device comprises a control system, an acceleration module, a shock wave speedup module, a machining module and a recovery module, wherein the control system controls the operation of the device; the acceleration module is composed of an acceleration tube (10), a small Laval tube (29), etc., and can make nanoparticles (11) obtain an initial speed; and the shock wave speedup module, which is composed of electromagnetic coils (13), shock heads (12), shock balls (16), wave collectors (18), large Laval tubes (19), etc., generates two wave sources, one being used for cleaning impurities on a surface of a grinding wheel (20), and the other being used for giving a shock to the nanoparticles (11), which have the initial speed, to the surface of the grinding wheel (20) to form a nano-layer (41). During a machining process, the nanoparticles (11) of the nano-layer (41) are autonomously released in a grinding core area, thereby realizing self-lubricating and cooling inside the grinding area; and the recovery module is used for recovering the nanoparticles (11), thereby realizing the reutilization of the nanoparticles.

Inventors:
Zhang Xiaohong
Shi Jiao Yao
Ding Yuejiao
Ning Liwei
Tan Xiaohong
Jean Song Hui
Lee Sea
Lee Wei
Tian Wangyi
Application Number:
JP2023515844A
Publication Date:
April 09, 2024
Filing Date:
September 07, 2021
Export Citation:
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Assignee:
HUNAN INSTITUTE OF SCIENCE AND TECHNOLOGY
International Classes:
B24B55/03; B01J3/08; B24B53/00; B24B55/02; B24D3/00; B24D3/06
Domestic Patent References:
JP2014037012A
JP2003103465A
Foreign References:
US20150126097
Attorney, Agent or Firm:
Patent Attorney Corporation Washida International Patent Office



 
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