Title:
THIN FILM FORMING DEVICE
Document Type and Number:
Japanese Patent JP3169151
Kind Code:
B2
Abstract:
PURPOSE: To provide the thin film forming device capable of forming diffusion barrier thin films having good coverage on the bases of contact holes which are provided on a substrate and have a large aspect ratio.
CONSTITUTION: The films are formed by using a spot evaporating source or annular evaporating source as the shape of an evaporating source 40 under the conditions under which the Knudsen number Kn (=λ/H) determined by the ratio of the average free path (λ) of film forming material particles and the distance (H) between the evaporating source and the substrate attains ≥0.1. The thin films are formed on the bases of the contact holes by setting the positional relation between the substrate 34 and the evaporating source 40 according to the aspect ratio of the contact holes.
Inventors:
Hisashi Tsukazaki
Goro Okamoto
Yuki Ito
Kenichiro Yamanishi
Hiroyuki Ishii
Hiroki Ito
Masahiro Hanai
Goro Okamoto
Yuki Ito
Kenichiro Yamanishi
Hiroyuki Ishii
Hiroki Ito
Masahiro Hanai
Application Number:
JP6184093A
Publication Date:
May 21, 2001
Filing Date:
March 22, 1993
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
C23C14/32; C23C14/04; C23C14/22; C23C14/24; C23C14/34; C23C14/35; C23C14/46; H01J37/305; H01J37/317; H01J37/34; H01L21/203; H01L21/285; H01L21/768; (IPC1-7): C23C14/32; H01L21/203
Domestic Patent References:
| JP1212761A | ||||
| JP4251920A | ||||
| JP3193867A | ||||
| JP465823A | ||||
| JP5844713A | ||||
| JP552736B2 |
Attorney, Agent or Firm:
Kodama Toshihide (4 outside)