Title:
ネガ型硬化性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
Document Type and Number:
Japanese Patent JP7334247
Kind Code:
B2
Abstract:
Provided are: a negative curable composition which gives a cured film having excellent film strength; a cured film obtained by curing the negative curable composition; a layered product containing the cured film; a method for producing the cured film; and a semiconductor device that includes the cured film or the layered product. This negative curable composition contains an alkali-soluble polyimide, a photo-radical generator, a thermal acid generator, an acid crosslinking agent and a solvent having a boiling point that is higher than the acid generation temperature of the thermal acid generator. The content of the solvent is 10 mass% or more relative to the total mass of the composition. The cured film is obtained by curing the negative curable composition. The layered product includes the cured film. The method for producing a cured film includes a film formation step. The semiconductor device includes the cured film or the layered product.
Inventors:
Yuichiro Enomoto
Toshie Qingdao
Toshie Qingdao
Application Number:
JP2021524742A
Publication Date:
August 28, 2023
Filing Date:
May 20, 2020
Export Citation:
Assignee:
Fujifilm Corporation
International Classes:
G03F7/004; C08G73/10; G03F7/027; G03F7/037
Domestic Patent References:
| JP2010210851A | ||||
| JP2004244358A |
Foreign References:
| WO2018047688A1 |
Attorney, Agent or Firm:
Sykes Patent Attorney Corporation