Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC DEVICE, AND POLYMER
Document Type and Number:
Japanese Patent JP2015007762
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition excellent in balance between resolution and time required for pattern formation, and to provide an electronic device and a polymer.SOLUTION: There is provided the negative photosensitive resin composition containing: a polymer which contains repeating units represented by the following formulae (1) and (2a), wherein Rin the formula (2a) has a radically polymerizable group and is a C2-C18 organic group; and a photoradical polymerization initiator. (In the formula (1), R, R, R, and Rare each independently hydrogen or a 1-30C organic group, and n is 0, 1, or 2.)
Inventors:
ONISHI OSAMU
IKEDA TAKAO
IKEDA TAKAO
Application Number:
JP2014101826A
Publication Date:
January 15, 2015
Filing Date:
May 15, 2014
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/038; C08F8/14; C08F232/08; C08F290/12; G03F7/004; G03F7/027
Domestic Patent References:
| JP2006243564A | 2006-09-14 | |||
| JP2007206165A | 2007-08-16 | |||
| JP2008180992A | 2008-08-07 | |||
| JP2001183521A | 2001-07-06 | |||
| JP2001125272A | 2001-05-11 | |||
| JP2001187807A | 2001-07-10 |
Foreign References:
| WO2011129182A1 | 2011-10-20 |
Attorney, Agent or Firm:
Shinji Hayami