NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, AND POLYIMIDE AND CURED RELIEF PATTERN PRODUCTION METHOD BASED ON THE SAME

Title:

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, AND POLYIMIDE AND CURED RELIEF PATTERN PRODUCTION METHOD BASED ON THE SAME

Document Type and Number:

Japanese Patent JP2021120698

Kind Code:

A

Abstract:

To provide a photosensitive resin composition which is excellent in adhesion to an encapsulant such as a mold resin, and can form a multilayer excellent in in-plane homogeneity and crack resistance and superior in elongation after a reliability test.SOLUTION: A negative photosensitive resin composition comprises (A) a polyimide precursor with a structural unit represented by the general formula (1), (B) a compound including at least one selected from a urethane bond and a urea bond, (C) a photoinitiator, and (D) at least one solvent selected from 3-methoxy-N,N-dimethylpropionamide and 3-butoxy-N,N-dimethylpropionamide.SELECTED DRAWING: None

Inventors:

HIRATA TATSUYA
FUJIOKA TAKANOBU
SHIMIZU KENJU

Application Number:

JP2020013784A

Publication Date:

August 19, 2021

Filing Date:

January 30, 2020

Export Citation:

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Assignee:

ASAHI KASEI CORP

International Classes:

G03F7/027; C08F290/14; C08G73/10; G03F7/004; G03F7/075; G03F7/20

Attorney, Agent or Firm:

Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima

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