To prevent generation of burrs during laser-fabricating holes in a copper-plated laminated plate and further, enable the holes to be perforated at a fine pitch by providing an organic peelable layer on the surface of a conductive support and further, forming a conductive fine particle group on the organic peelable layer.
The composite foil is constituted of an organic peelable layer 23 formed on the surface of a conductive support 22 and a conductive fine particle group 24 formed on the surface of the layer 23 in a separable manner. The conductive support 22 is above all, suitably a copper foil or a copper alloy foil, preferably with a thickness of 5-200 μm. The organic peelable layer 23 is preferably formed of especially a nitrogen-containing compound, a sulfur- containing compound or at least one kind of organic compound consisting of a carboxylic acid. The layer is desirably normally 1-1,000 thick. In addition, the conductive fine particle is preferably made up especially of copper or a copper alloy, desirably with a size in the thickness direction of 0.1-5.0 μm. In addition, the conductive fine particle is desirably formed to the density of 2-10 g/m2.
HIRASAWA YUTAKA
YAMAMOTO TAKUYA
IWAKIRI KENICHIRO
HIGUCHI TSUTOMU
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