Title:
NEW EPOXY RESIN, RESIN COMPOSITION AND CURED MATERIAL THEREOF
Document Type and Number:
Japanese Patent JPH04337314
Kind Code:
A
Abstract:
PURPOSE:To obtain the title new resin suitable for sealing electronic parts, having low reduction in melt viscosity, excellent workability, providing a cured material with a low content of hydrolyzing chlorine, high heat resistance and low water absorption properties by epoxidizing a naphthol polymer containing no methylene chain. CONSTITUTION:A naphthol resin (e.g. 1-naphthol polymer) shown by formula I (R is H, 1-4C alkyl, aryl or halogen; n is 0-10) having excellent thermal stability is reacted with an epihalohydrin compound (e.g. epichlorohydrin) shown by formula II (X is halogen) in a nitrogen atmosphere in the presence of a basic compound (e.g. sodium hydroxide) at 60 deg.C, formed water and water in an aqueous solution of sodium hydroxide are continuously removed out of the reaction system by azeotropy and the reaction product is extracted with a solvent such as methyl isobutyl ketone to give a new epoxy resin based on a naphthol shown by formula III free from methylene chain.
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Inventors:
MURATA KAZUYUKI
MORITA HIROMI
MOGI SHIGERU
ISHII TOMIYOSHI
HAMAGUCHI MASAHIRO
MORITA HIROMI
MOGI SHIGERU
ISHII TOMIYOSHI
HAMAGUCHI MASAHIRO
Application Number:
JP13868091A
Publication Date:
November 25, 1992
Filing Date:
May 15, 1991
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C07D303/27; C08G59/06; C08G59/20; H01L23/29; H01L23/31; (IPC1-7): C07D303/27; C08G59/20; H01L23/29; H01L23/31