To provide a photosensitive resin composition solution which allows fine pattern printing by an inkjet system, is curable by active energy beams and low-temperature heating (250C or below), and has low viscosity despite not containing organic solvents, and to provide a coating film of the photosensitive resin composition obtained from the solution and having good physical properties, and to provide a method for utilizing the same.

The photosensitive resin composition solution contains an imidized tetracarboxylic acid with a specific structure, a diamine- and/or isocyanate-based compound, a photosensitive resin, and a photopolymerization initiator, contains no organic solvents, and has viscosity of 100 mPa s or less at 25C.