Title:
NEW THERMOSETTING POLYMERIZATION LIQUID AND THERMOSETTING RESIN USING THE SAME
Document Type and Number:
Japanese Patent JP2008069205
Kind Code:
A
Abstract:
To obtain a new thermosetting polymerization liquid and a thermosetting resin using the same.
The thermosetting polymerization liquid is obtained by polymerizing a compound group consisting essentially of a compound (a) containing one (meth)acrylic group and one alicyclic epoxy group and has a viscosity of 10 mPa s to 2,000,000 mPa s at 25C.
Inventors:
SAKATA YUKO
TOMITA HIROYUKI
UCHIDA HIROSHI
TOMITA HIROYUKI
UCHIDA HIROSHI
Application Number:
JP2006247071A
Publication Date:
March 27, 2008
Filing Date:
September 12, 2006
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
C08G59/32; C08F2/02; C08F4/32; C08F20/32; C08F26/06
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Fukumoto product
Tetsuji Koga
Kazuhiro Nakamura
Takashi Ishida
Fukumoto product
Tetsuji Koga
Kazuhiro Nakamura