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Title:
NON-CONTACT DATA RECEIVING/TRANSMITTING BODY, MANUFACTURING METHOD THEREOF, RESIN MOLDING INCLUDING NON-CONTACT DATA RECEIVING/TRANSMITTING BODY, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2013105380
Kind Code:
A
Abstract:

To provide a non-contact data receiving/transmitting body which has an antenna prevented from being disconnected due to expansion and contraction of an objective article when used in a state of being embedded in the article and is superior in mechanical strength of the antenna, a manufacturing method thereof, a resin molding including a non-contact data receiving/transmitting body, and a manufacturing method thereof.

A non-contact data receiving/transmitting body 10 includes: a substrate 11; an IC chip 12 and a first antenna part 13 which are provided on one surface 11a of the substrate 11 and are electrically connected to each other; an insulating part 14 which covers the IC chip 12 and its periphery and is made of insulating resin; and second antenna parts 15 and 16 which are disposed so as to overlap a part of the first antenna part 13 and are made of conductive resin. The conductive resin and the insulating resin contain rubber having main chains of the same structure, as main components and contain vulcanizers.


Inventors:
OISHI NORIHIRO
KAGAYA HITOSHI
Application Number:
JP2011249756A
Publication Date:
May 30, 2013
Filing Date:
November 15, 2011
Export Citation:
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Assignee:
TOPPAN FORMS CO LTD
International Classes:
G06K19/077; B42D15/10; G06K19/07
Domestic Patent References:
JP2005210676A2005-08-04
JP2001114943A2001-04-24
JP2003335116A2003-11-25
JP2005116771A2005-04-28
Foreign References:
US20110198402A12011-08-18
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga