To provide a non-contact IC card wherein the smoothness of the card surface is favorable, and the generation of warping is less, and which has a favorable durability, and its manufacturing device.
At least on a base material 1, an IC module 2, a core 3 which is an intermediate layer, and an over sheet 4 are accumulated in order for this non-contact IC card. For such a non-contact IC card, the core 3 of the intermediate layer has a bonding function, and also, the over sheet 4 is provided on the top of a resin which is formed by adjusting to the shape of the IC module 2 to be loaded, and the core 3 of the intermediate layer. As its manufacturing device, after forming a resin which becomes the core of the intermediate layer, the resin is inserted between the base material 1 and the over sheet 4, and laminated, and by doing so, the non-contact IC cards are continuously manufactured.
KOBAYASHI KAZUO
CHIYOU SHIYOUTEI
MIYAMA AKIRA
ARAI YOSHIE
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