Title:
NON-CONTACT IC CARD
Document Type and Number:
Japanese Patent JP3844268
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance environmental resistance and to strengthen a non-contact IC card against a bending stress by providing an IC chip and antenna coil having a lead part between a base film and a cover film, and filling the gap between the base film and the cover film with filling material.
SOLUTION: An antenna coil 2 and IC chip 3 are joined to a base film 11. Lead parts 21 of the coil are each formed in a U shape in a thickness direction of an IC card 1, and connected with electrodes 31 of the chip 3. A cover film 12 is stuck so that the chip 3 and coil 2 are disposed between the film 11 and the film 12. Further, filling adhesive 13 is fed in the gap between the film 11 and the film 12.
Inventors:
Toshio Kajiya
Kenichiro Kobayashi
Kenichiro Kobayashi
Application Number:
JP20715597A
Publication Date:
November 08, 2006
Filing Date:
July 15, 1997
Export Citation:
Assignee:
NEC TOKIN CORPORATION
International Classes:
B42D15/10; G06K19/07; G06K19/077; (IPC1-7): B42D15/10; G06K19/07; G06K19/077
Domestic Patent References:
| JP6052374A | ||||
| JP8235335A | ||||
| JP9131987A | ||||
| JP62083196A | ||||
| JP1175883U | ||||
| JP61155975U |