To provide a non-contact IC medium that reliably breaks an antenna or the like of a non-contact IC medium to disable communication when a packaging material is opened.
A packaging material with the non-contact IC medium is formed by bonding, with an adhesion layer 15 interposed, a function-breaking packaging material 2 breaking principal functional elements of the non-contact IC medium when the packaging material is opened, to a non-contact IC medium 1 including an antenna 13 and an IC chip 14 that are provided on a one surface part of a support body 11 with a peeling layer 12 interposed therebetween. Adhesive strength between the support body 11 and the antenna 13 constituting the non-contact IC medium 1 is made smaller than adhesive strength between the function-breaking packaging material 2 and the adhesion layer 15.
| JP2010182217A | 2010-08-19 | |||
| JP2000105807A | 2000-04-11 | |||
| JP2005258351A | 2005-09-22 | |||
| JP2008310539A | 2008-12-25 | |||
| JP2006123917A | 2006-05-18 |
Hironobu Onda
Kurata Masatoshi
Takakura Shigeo
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori