To reduce costs by reducing the loss of non-contact IC tag materials.
In an IC module using a technology for joining(JO) two metals(M) over a film(F) with ultrasonic vibration(UL) called JOMFUL(R) technology(technology for JOining two Metals over Film with ULtrasonic vibration), this non-contact IC tag manufacturing method and device therefor is provided to but a measuring terminal for inspection to the upper face of an insulating layer in such a status that an insulating layer exists on the upper face of the conductive circuit of the IC module, and to arrange the butted face of the measurement terminal almost in parallel with the upper face of the conductive circuit, and to form a capacitor of the measuring terminal and the insulating layer and the conductive circuit, and to inspect the operation of the IC module through the capacitor, and to connect the IC module whose inspection has succeeded to an antenna.
| JP2005129037A | 2005-05-19 |
| WO2005073902A1 | 2005-08-11 | |||
| WO2004072892A2 | 2004-08-26 |
Motoaki Nagata
Hironori Nishihara