Title:
非硬化型熱伝導性シリコーン組成物
Document Type and Number:
Japanese Patent JP6959950
Kind Code:
B2
Abstract:
The present invention is a non-curable thermal-conductive silicone composition containing essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25°C of 1,000,000 mm2/s or more in an amount of 5 to 20 mass% relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass% relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass% relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. R1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. "m" represents an integer of 5 to 100. This provides a non-curable thermal-conductive silicone composition containing a large amount of the heat conductive filler but having excellent coating workability and favorable pumping-out resistance by keeping appropriate viscosity.
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Inventors:
Keita Kitazawa
Wataru Toya
Wataru Toya
Application Number:
JP2019038421A
Publication Date:
November 05, 2021
Filing Date:
March 04, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/04; C08K3/22; C08K3/28
Domestic Patent References:
| JP2010150399A | ||||
| JP2015140395A | ||||
| JP200515462A |
Foreign References:
| WO2019039468A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi