To provide a non-halogen adhesive composition giving a cured product excellent in flame retardancy, migration property, glass transition temperature, soldering heat resistance and processability, and a coverlay film and an adhesive sheet each having an adhesive layer comprised of the composition.
The adhesive composition comprises (A) a phenoxy resin having a molecular weight of at least 10,000, a glass transition temperature of 40°C or higher and bearing epoxy groups on the both ends of the molecular chain, (B) a non-halogen epoxy resin, (C) a carboxy group-containing acrylic resin, (D) a curing agent, (E) an inorganic filler, and (F) a phosphorus-containing flame retardant, where the ratio of the component (C) to the total of the components (A)-(D) is 10-60 mass%; the ratio of the components having a glass transition temperature of 30°C or higher in the components (A)-(D) is 40-90 mass%; and the phosphorus content in the whole organic solid component is at least 2.5 mass%. The adhesive sheet and the coverlay film are obtained using the composition.
AIZAWA MICHIO
AMANO TADASHI
