Title:
高温用途向けの非侵襲的プロセス流体温度表示
Document Type and Number:
Japanese Patent JP7233524
Kind Code:
B2
Abstract:
A process fluid temperature estimation system includes a mounting assembly that is configured to mount the process fluid temperature estimation system to an external surface of a process fluid conduit. A sensor capsule has at least one temperature sensitive element disposed therein. Measurement circuitry is coupled to the sensor capsule and is configured to detect a characteristic of the at least one temperature sensitive element that varies with temperature and provide sensor capsule temperature information. A high temperature spacer has a known thermal conductivity and is configured to be interposed between the external surface of the process fluid conduit and the at least one temperature sensitive element. A controller is coupled to the measurement circuitry and is configured to obtain a reference temperature and employ a heat transfer calculation with the reference temperature, the sensor capsule temperature information and the known thermal conductivity of the high temperature spacer to generate an estimated process fluid temperature output.
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Inventors:
Rudd, Jason H
Application Number:
JP2021516580A
Publication Date:
March 06, 2023
Filing Date:
September 19, 2019
Export Citation:
Assignee:
Rosemount Incorporated
International Classes:
G01K1/14; G01K7/16; G01K13/02
Domestic Patent References:
| JP2017502299A | ||||
| JP5161871A |
Foreign References:
| US20170212065 | ||||
| US20040101030 | ||||
| WO2018005082A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni
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