Title:
高周波接合法で形成された接合パターン線を用いた織物の無縫製結合方法
Document Type and Number:
Japanese Patent JP6683739
Kind Code:
B2
Abstract:
The present invention can combine fabrics in a seamless manner by forming at least one bonding pattern line by a process comprising: printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, and/or an outer fabric or an optional mesh material in a predetermined pattern, laminating said inner fabric, optional reinforced material and outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, and outer fabric. Since the present invention combines fabrics by employing a high-frequency bonding manner in which a heat-reactive adhesive is used, it is possible to combine fabrics in a seamless manner with a bonding pattern line which is composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with a good clearness and finishing quality.
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Inventors:
Park, Yong Chu
Application Number:
JP2017564403A
Publication Date:
April 22, 2020
Filing Date:
July 05, 2016
Export Citation:
Assignee:
Hojong Limited
International Classes:
A41H43/04; B29C65/48; D06M17/00
Domestic Patent References:
| JP2000328462A | ||||
| JP3018852U |
Attorney, Agent or Firm:
Shinei Patent Office