To provide a polyimide resin with high transparency useful as a circuit material, excellent in warpage-proof property, soluble in an organic solvent of a low boiling point and capable of being imidized at a low temperature, and a polyamic acid, i.e., its precursor.

The novel polyamic acid contains a tetracarboxylic acid dianhydride represented by formula (1) and a diamine (I) represented by formula (2): (wherein R represents a 5-19C alkylene group which may be substituted by a halogen atom) as essential components.