To pick up an electronic component by inserting an adsorptive nozzle without causing damage to the electronic component even if the electronic component having a long hole shape recessed part on the surface is rotated by a tray or an embossed tape.

The nozzle 11 adsorps the electronic component by inserting the nozzle into the long hole shape recessed part formed on the surface of the electronic component. The tip end part of the nozzle 11 is formed to be an approximately rectangular cross section, and the both side surfaces 12 of the long side of the tip end part are formed to be a curved surface so that the thickness is gradually reduced from the midpoint part to the directions of the both ends.