Title:
NOZZLE FOR WIRE BONDING
Document Type and Number:
Japanese Patent JPH08203947
Kind Code:
A
Abstract:
PURPOSE: To provide a nozzle which can stably form a ball while completely cutting off oxygen in the air, in a ball bonder.
CONSTITUTION: When wire bonding is performed by using a metal wire like a copper wire and an aluminum wire, except a gold wire, inert gas is supplied to a wire ball forming part from a nozzle. As to the nozzle, the jetting port of the inert gas is formed as multistructure constituted of a nozzle 1 and a nozzle 2 which is arranged coaxially to the nozzle 1.
Inventors:
TEJIMA TAKAHITO
Application Number:
JP800495A
Publication Date:
August 09, 1996
Filing Date:
January 23, 1995
Export Citation:
Assignee:
SONY CORP
International Classes:
F15D1/08; B01J19/14; H01L21/60; (IPC1-7): H01L21/60; B01J19/14; F15D1/08
Attorney, Agent or Firm:
Kuninori Funabashi
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