Title:
ラバースプリング装置を架設したオフロードトラック
Document Type and Number:
Japanese Patent JP4864153
Kind Code:
B2
Abstract:
A rubber spring device (30) is formed by alternately laminating a plurality of layers of hard plates (32) whose linear dimension W in a direction parallel to the longitudinal direction of each equalizer bar (23) is shorter in plan view than a linear dimension H in a direction parallel to an axle direction, and rubber layers (33). The rubber spring device (30) is disposed between an end portion of each equalizer bar (23) and a center axle (13) in an articulated dump truck, and is allowed to function as a suspension. Thus, even when the rubber spring device (30) is deformed into an accordion shape, peak positions of an internal stress within each rubber layer (33) can be dispersed and reduced, thereby preventing generation of cracks within each rubber layer. Selected Drawing: FIG. 6
Inventors:
Tomoyuki Moriyama
Minoru Tazawa
Minoru Tazawa
Application Number:
JP2010149241A
Publication Date:
February 01, 2012
Filing Date:
June 30, 2010
Export Citation:
Assignee:
KOMATSU LTD.
International Classes:
B60G11/22; B60G5/02; F16F1/40; F16F15/04
Domestic Patent References:
JP2007333052A | ||||
JP5338552A | ||||
JP2002527702A | ||||
JP200657833A |
Attorney, Agent or Firm:
Takeo Noguchi
Katsutoshi Shiozawa
Katsutoshi Shiozawa