Title:
ONE-CHIP ACCUMULATION SENSOR
Document Type and Number:
Japanese Patent JPH0897439
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a micro-mechanical element and a integrated circuit device at the same time on the same substrate, so as to obtain the minimum number of processing steps. SOLUTION: An accelometer 110 using a bridge, a cantilevered beam, a suspending mass 60 and a compact micro-mechanical element such as a diaphragm or a capacitive element supported on a cavity 22, is formed on a silicon substrate 18 and a device such as pressure sensor can be formed. A piezoelectric resistor used for detecting the displacement of the micro-mechanical element 60 is formed at the same time as the various elements of the integrated circuit device 12. As the result, the processing can be performed with minimum processing steps.
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Inventors:
SUPAAKUSU DAGURASU REI
Application Number:
JP23385395A
Publication Date:
April 12, 1996
Filing Date:
September 12, 1995
Export Citation:
Assignee:
DELCO ELECTRONICS CORP
International Classes:
G01P15/125; G01L9/00; G01L9/04; G01P15/08; H01L29/84; (IPC1-7): H01L29/84; G01L9/04; G01P15/125
Domestic Patent References:
| JPH05102494A | 1993-04-23 | |||
| JPS60230028A | 1985-11-15 | |||
| JPS6261374A | 1987-03-18 | |||
| JPS6384072A | 1988-04-14 | |||
| JPH02137273A | 1990-05-25 | |||
| JPH0529633A | 1993-02-05 | |||
| JPH0510968A | 1993-01-19 |
Attorney, Agent or Firm:
Kyozo Yuasa (5 people outside)
Next Patent: GLASS-SEALED DIODE