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Title:
ONE-PACKAGE CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2000345054
Kind Code:
A
Abstract:

To obtain a resin composition excellent in mechanical properties, adhesion to substrates, and restorability and proof against a decrease in catalytic activity during storage by including a reactive-silicon-group-containing polymer with a reactive-silicon-group-containing compound, a non-phthalic ester plasticiz er, and a divalent tin curing catalyst.

This composition is obtained by mixing 100 pts.wt. polymer having at least one reactive silicon group in the molecule with 0.01-100 pts.wt. compound having a reactive silicon group in the molecule, 1-1,000 pts.wt. non- phthalic ester plasticizer having no phthalic acid structure in the molecule, 0.01-10 pts.wt. divalent tin curing catalyst. The composition is stored in a moisture-tight closed container. The non-phthalic acid ester plasticizer is at least one compound selected from among an aliphatic dibasic acid ester, a glycol ester, an aliphatic ester, a phosphoric ester, an epoxy plasticizer, a polyether plasticizer, an ester plasticizer, etc.


Inventors:
FUKUNAGA ATSUSHI
MASAOKA YOSHITERU
ANDO HIROSHI
KAWAKUBO FUMIO
Application Number:
JP2000061975A
Publication Date:
December 12, 2000
Filing Date:
March 07, 2000
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C09K3/10; C08K5/01; C08K5/02; C08K5/098; C08K5/103; C08K5/1515; C08K5/521; C08K5/5445; C08L25/02; C08L71/02; C08L101/10; (IPC1-7): C08L101/10; C08K5/01; C08K5/02; C08K5/098; C08K5/103; C08K5/1515; C08K5/521; C08K5/5445; C08L25/02; C08L71/02; C09K3/10