Title:
対向ターゲット式スパッタ成膜装置
Document Type and Number:
Japanese Patent JP7102260
Kind Code:
B2
Abstract:
To provide a technique for preventing a non-erosion region from occurring on a target surface to suppress the occurrence of particles caused by the peeling of film in the non-erosion region in a facing target sputtering film deposition apparatus.SOLUTION: A facing target sputtering film deposition apparatus comprises: backing plates 6A and 6B arranged to sandwich an electrical discharge space 21; targets 5A and 5B oppositely arranged to sandwich the electrical discharge space 21; magnet devices 9A and 9B arranged so as to face different magnetic poles to each other at positions corresponding to edge portions of the targets 5A and 5B on the rear surface sides of the backing plates 6A and 6B; and a high frequency power supply 22 for supplying high frequency electric power to each of the backing plates 6A and 6B. Anode electrodes 7A and 7B having a coupling capacity controlled between the surfaces of the targets 5A and 5B are provided so as to adjacently surround the peripheries of the targets 5A and 5B.SELECTED DRAWING: Figure 1
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Inventors:
Yutaka Nakamitsu
Application Number:
JP2018124237A
Publication Date:
July 19, 2022
Filing Date:
June 29, 2018
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/34; C23C14/00; H05H1/46
Domestic Patent References:
| JP8013143A | ||||
| JP5125527A | ||||
| JP2013079420A | ||||
| JP2009280882A | ||||
| JP2010156018A | ||||
| JP2000328243A | ||||
| JP7034236A |
Attorney, Agent or Firm:
Patent Business Corporation Minami Aoyama International Patent Office
Junichi Omori
Takahashi Mitsuru
Teppei Nakamura
Hibino Yukinobu
Junichi Omori
Takahashi Mitsuru
Teppei Nakamura
Hibino Yukinobu