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Title:
発光ダイオードにおける出力フラックスを改善する光結合層
Document Type and Number:
Japanese Patent JP7261360
Kind Code:
B2
Abstract:
An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

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Inventors:
Lopez-Julia, Antonio
Meyer, Jens
Van Gerwen, Marcel
Miss Song, Ronya
Feldman, Jorg
Bechtel, Hans-Helmut
Application Number:
JP2022521290A
Publication Date:
April 19, 2023
Filing Date:
October 09, 2020
Export Citation:
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Assignee:
Lumileds Limited Liability Company
International Classes:
H01L33/22; F21S41/141; H01L33/08; H01L33/50
Domestic Patent References:
JP2015076456A
JP2015505736A
JP2017199933A
JP2015099945A
JP2007266356A
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Osamu Miyazaki



 
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