Title:
OPTICAL DISK SUBSTRATE
Document Type and Number:
Japanese Patent JPH02304736
Kind Code:
A
Abstract:
PURPOSE: To absorb squeezed out hot-melt adhesive in chamfers of substrates by chamfering the circumferential edges of substrates.
CONSTITUTION: The substrate 1 is molded by injection to have chamfer 4 on the outer circumference edge 3. Namely, the substrates are stuck together by applying hot-melt adhesive 2 on the facing surfaces and pressed. The hot-melt adhesive is squeezed out from the outer circumferential edge 3, where chamfer 4 is formed to avoid squeezing of the adhesive from the substrates. The extra hot-melt adhesive remains in the space formed by chamfers 4 and prevented from squeezing out form the substrates.
Inventors:
ODA HIROSHI
Application Number:
JP12561389A
Publication Date:
December 18, 1990
Filing Date:
May 18, 1989
Export Citation:
Assignee:
NEC CORP
International Classes:
G11B7/24024; (IPC1-7): G11B7/24
Attorney, Agent or Firm:
Uchihara Shin