PURPOSE: To prevent a short circuit due to contact of bonding wires with a pedestal for mounting a photodetector by equalizing in height an upper surface of a pedestal for mounting a semiconductor laser to that of the pedestal for mounting the photodetector.
CONSTITUTION: A pedestal 12 for mounting a semiconductor laser, is formed at a center of a stem 11, and pedestals 13A, 13B for mounting photodetectors, are formed at both sides of the pedestal 12 for mounting the laser. A step is formed at the pedestals 13A, 13B for mounting the photodetectors, which are equalized at the upper surfaces in height to that of the pedestal 12 for mounting the laser. Thus, when a heat sink is wire bonded to a terminal formed at the stem, contact of the wire with the pedestals for mounting the photodetectors can be prevented. In this manner, a mounting defect of an optical element can be reduced, and yield can be improved.
IWANO HIDEAKI
SEKI TETSUYA
ASAGA TATSUYA
WATANABE KAZUAKI
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