Title:
OPTICAL MODULE AND LEAD FRAME
Document Type and Number:
Japanese Patent JP3416942
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a small and high-density optical module with a a plurality of optical elements and a plurality of circuit elements, along with a lead frame for the optical module.
SOLUTION: An optical module includes circuit elements 30 and 32 which are connected electrically to an optical element, a lead frame for mounting these elements on a same main face, and a first sealing resin body 66 made of resin, through which an optical signal treated by the optical element passes, and are used for sealing the optical element. A lead frame includes a first single pad for mounting a plurality of optical elements, a plurality of second pads 4 and 6 for mounting each circuit element, connecting lead groups 40 and 42 with the same number as the second pads for electrically connecting the optical element on the first pad and the circuit elements on the second pads 4 and 6, and wiring leads 50 and 51 provided on the side face of the second die pads 4 and 6. The optical element is connected via the connection lead to the wiring leads 50 and 51.
Inventors:
Takashi Fukuoka
Application Number:
JP26019297A
Publication Date:
June 16, 2003
Filing Date:
September 25, 1997
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L23/48; H01L23/52; H01L25/16; H01L31/02; H01L33/54; H01L33/56; H01L33/62; (IPC1-7): H01L23/48; H01L23/52; H01L31/02; H01L33/00
Domestic Patent References:
| JP11150225A | ||||
| JP1187781A | ||||
| JP7131286A | ||||
| JP6350012A |
Attorney, Agent or Firm:
Yoshiki Hasegawa (4 outside)
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