Title:
鏡面基板を用いた光受信器アーキテクチャ
Document Type and Number:
Japanese Patent JP5755738
Kind Code:
B2
Abstract:
Techniques and architectures for providing a reflective target area of an integrated circuit die assembly. In an embodiment, a reflective bevel surface of a die allows an optical signal to be received from the direction of a side surface of a die assembly for reflection into a photodetector. In another embodiment, one or more grooves in a coupling surface of the die provide respective leverage points for aligning a target area of the bevel surface with a detecting surface of the photodetector.
Inventors:
Heck, John
Liu, Ancheyon
Panicia, Mario, Jay.
Liu, Ancheyon
Panicia, Mario, Jay.
Application Number:
JP2013518524A
Publication Date:
July 29, 2015
Filing Date:
June 27, 2011
Export Citation:
Assignee:
Intel Corporation
International Classes:
G02B6/42; H01L31/0232
Domestic Patent References:
| JP7199006A | ||||
| JP7151940A | ||||
| JP2000241642A | ||||
| JP2002529787A | ||||
| JP2009229809A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki