Title:
光半導体装置及び光半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4846515
Kind Code:
B2
Abstract:
An optical semiconductor device includes: an optical semiconductor element including a light-emitting layer formed on a first principal surface, a first electrode formed on the light-emitting layer and having a smaller size than the first principal surface, and a second electrode formed on a second principal surface different from the first principal surface; a first lead portion including a bonding region to which the first electrode is bonded and which has a smaller size than the first principal surface, and a first groove portion formed on an outer peripheral region adjacent to the bonding region, the first lead portion being electrically connected to the first electrode bonded to the bonding region by use of a bonding member; and a second lead portion electrically connected to the second electrode by use of a connecting member.
Inventors:
Issei Shimokawa
Uchida Yasunari
Uchida Yasunari
Application Number:
JP2006283597A
Publication Date:
December 28, 2011
Filing Date:
October 18, 2006
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L33/50; H01L33/62; H01L33/56
Domestic Patent References:
| JP2072573U | ||||
| JP2002076373A | ||||
| JP2006080141A | ||||
| JP2001352100A |
Foreign References:
| WO2005091383A1 | ||||
| WO2004077630A1 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu