Title:
OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017055139
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which never causes delamination or crack even if solder reflow is performed with moisture absorbed while a sealing resin has a high gas barrier property.SOLUTION: An optical semiconductor device comprises: a light-emitting element having a luminescent layer made of a semiconductor; a lead frame electrically connected to the light-emitting element; a reflector resin; and a sealing resin. The reflector resin is 0.5% or less in moisture absorptivity, and 30% or more in moisture release rate. Further, the sealing resin has a moisture permeability of 20 g/m/day or less at a temperature of 40°C under an environment of 90% in relative humidity.SELECTED DRAWING: None
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Inventors:
TANI HISAKO
SUGIYAMA TOMOHITO
MANABE TAKAO
SUGIYAMA TOMOHITO
MANABE TAKAO
Application Number:
JP2016236876A
Publication Date:
March 16, 2017
Filing Date:
December 06, 2016
Export Citation:
Assignee:
KANEKA CORP
International Classes:
H01L33/60; C08K3/00; C08L101/02; H01L33/56; H01L33/62
Domestic Patent References:
| JP2005146191A | 2005-06-09 | |||
| JP2012124428A | 2012-06-28 | |||
| JP2012012556A | 2012-01-19 | |||
| JP2010192624A | 2010-09-02 |
Attorney, Agent or Firm:
Atomi International Patent Office
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